Bond procedure requested information data. More...
#include <bf0_ble_gap.h>
Data Fields | |
| uint8_t | auth_req |
| Authentication level (. More... | |
| uint8_t | key_size |
| LTK Key Size (if request = GAPC_LTK_EXCH) | |
| uint8_t | tk_type |
| ble_gap_oob_t | oob_data |
| Addition OOB Data for the OOB Conf and Rand values. | |
| ble_gap_nc_t | nc_data |
| Numeric Comparison Data. | |
Bond procedure requested information data.
| uint8_t ble_gap_bond_req_data_t::auth_req |
Authentication level (.
| uint8_t ble_gap_bond_req_data_t::tk_type |
Device IO used to get TK: (if request = GAPC_TK_EXCH)